Ramcon Fiberlok Incorporated

Fiber Bonding Resins

Our system permits the optimum combinations of fibers and bonding resins for maximum performance at minimum costs.

One element of a wholly successful process involves selecting the optimum fiber and powdered resin. The other is combining the two efficiently and uniformly at maximum production rates and minimum cost. We at RAMCON-FIBERLOK have dedicated ourselves to helping our customers achieve this result.

Bonded nonwovens can be made in a variety of ways, but only the RAMCON-FIBERLOK process has so many ways to combine fibers with specialized bonding powders to provide batts and pads specifically engineered for their intended uses.

Like the range of fibers suitable for our purposes, the bonding powders themselves come in particle sizes best suited for the particular fiber mix to be bonded. Moreover, the chemistry of the bonding powders may be adjusted to suit the end-use requirements.

Ramcon-Fiberlok, Inc. Dry Powdered Bonding Resin Products

Flex-Lok® S4000
Utility grade thermoset resin that is a mixture of epoxy and epoxy-polyester powdered polymer resins, containing no phenol or formaldehyde. The resin does not emit significant levels of chemicals upon curing. Our studies suggest the material loses less than 1.0 wt. % on curing and the majority of the weight loss is in the form of water. The material is ideal for bonding most types of fibers into flat nonwoven batts. Typically, curing the resin requires 400°F for 1 minute when making flat nonwoven batts. The resin is satisfactory for some molded nonwoven products. In nonwoven molding applications we recommend the resinated nonwoven batt is B-staged at 250°F for 1 minute. Hot molding requires 2-3 minutes at 400°F. We recommend product resin content of 10-15% for flat products and 25-35% for molded products, but these levels may vary in special applications.

BANFLAME FL-B®
Utility grade thermoset resin that is a mixture of epoxy and epoxy-polyester powdered polymer resins, modified with a proprietary flame retardant. The resin contains no phenol or formaldehyde. The resin does not emit significant levels of chemicals upon curing. Our studies suggest the material loses less than 1.0 wt. % on curing and the majority of the weight loss is in the form of water. The material is ideal for bonding most types of fibers into flat nonwoven batts. Typically, curing the resin requires 400°F for 1 minute when making flat nonwoven batts. Depending on the level of flame retardance required, the fibers used, and the specific product application, Ramcon-Fiberlok, Inc. will work with the customer to optimize BANFLAME® resin formulation and add-on level needed to meet the bonding and flame retardance requirements at the lowest possible cost.

MDPE Resin
Natural or mixed-color reground polyethylene resin for lamination applications.

Ramcon-Fiberlok, Inc.
5526 Pleasant View Rd.
Memphis, TN 38134 USA
901-387-0500 Phone
901-387-0400 Fax
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